Wire-Bond APE

MIS Package & Application	Description	Advantages
	* Package Size: 6x6 up to 15x15mm * Line & Space 15/15 µm * Wire-bond pitch down to 70 µm * Min. via opening 50 µm	* Able to build up to 4 layers. * Jumping wire possible * High I/O count and short interconnects. * High layout density requirement.

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