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* Package Size: 3x3 up to 19x19mm
* Min. Thickness: 0.08mm
* Ball Pitch (mm): 0.8, 0.65, 0.5, 0.4, 0.3.
* Structure: single, multiple, embedded active die. |
* Small scale and light weight.
* Low inductance, low capacitance and enhanced electrical and thermal performance.
* Low I/O digital baseband.
* Low noise for medical processors (Tiebarless)
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