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* Package Sie: 6x6 up to 25x25mm
* Line & Space 15/15 µm
* Wirebond pitch down to 70 µm
* Ranging from 1 to 2 Layers
* No Soldermask |
* Jumping wire possible.
* High I/O count and short interconnects.
* High layout density requirement.
* Hand-held, mobile, net-working, smart phone
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