WB+FC Power Amplifier

MIS Package & Application	Description	Advantages
	* Package Size: 0.6x0.6 up to 5x5mm * Line & Space 15/15 µm * Ultra small for COL - DFN * Flat surface for die attachments for COL	* PA, PMIC, PARF * Mobile, net-working, smart phone, consumer electronics & smart TV.

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