| Package Inspected |
BGA, QFP, QFN, CSP, TSOP, MSOP, SOP |
| Package Size |
2mm x 2mm to 42.5mm x 42.5mm |
| Tape Range |
8mm to 56mm |
| Handling Mechanism |
Tray to Tray |
| UPH |
18K |
| Taping Module Conversion Time |
< 20 mins |
| De-Taping |
Built-in De-Taping |
| Dual section X3 with warpage clamper |
Yes |
| Vision Inspection |
3D Inspection, 5-sided Inspection, Mark Inspection, Package Vision Inspection (PVI) |
| Machine Dimensions (mm) |
2100(H) x 2518(W) x 1250(L) |