| UPH |
Sprint: 40K; With inspection: up to 32K |
| Index Time |
Below 60ms, depending on device and process. |
| Device Range |
WLCSP & QFN: 1x1 - 7x7mm; | Thickness ≥ 0.1mm |
| Process |
Flip, Non-flip process |
| Input |
Wafer |
| Wafer Input Media |
Film Frame Carrier: 6" to 12"| Round and rectangular / plastic and metal frame| |
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Wafer Cassette: 25 x 8", 13 x 12" |
| Output |
Bin, Tape & Reel | Tape Width: 8mm, 12mm |
| MTBA |
Typ. > 1 h |
| MTBF |
Typ. > 168 h |
| Vision |
Standard Configuration: |
Optional: |
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1. Wafer Alignment Vision A & B |
5. 4S Package Vision |
1. 3D BGA |
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2. Position Check Vision |
6. Die Placement Vision |
2. IR Inspection |
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3. Top Package Vision |
7. Die Seating Vision |
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4. 2D BGA Vision |
8. InPocket Package Vision |
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9. Post Seal Vision |
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| Conversion Time |
Typ. < 45 min |
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| Input Voltage |
415 VAC, 3 Phase, 50/60Hz |
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| Compress Air |
5 - 10 ± 0.5 bar |
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| Vacuum |
-0.5 ± 0.1 bar |
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| Dimension (LxWxH) |
2.45 x 1.92 x 2.0m |
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| Weight |
< 2500 kg |
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