V310i

V310i : Tray to Tray Vision HandlerAdvanced 3D Solder Paste Inspection System (SPI)

V310i Advanced 3D Solder Paste Inspection System (SPI) soluton.
The V310i Series offers powerful technologies and high throughput productivity for SMT production line.

Board Dimensions	V310i
Maximum board size (Single Lane)	-
Maximum board size	510 mm by 510 mm (20 inch by 20 inch) with 2 projectors
Minimum board size	50 mm by 50 mm (2 inch by 2 inch)
Maximum board thickness	4 mm (0.16 inch)
Minimum board thickness	0.5 mm (0.02 inch)
Board weight	Up to 3kg (6.6lb)
Maximum inspected area	503 mm by 510 mm (19.8 inch by 20 inch) with 2 projectors

Clearance
Top side of board	15 mm (0.6 inch)
Bottom side of board	50 mm (1.96 inch)
Minimum edge clearance	3.5 mm (0.14 inch)
Maximum PCB Warpage	±5mm
Conveyor height range	856 mm to 965 mm (33.7 inch to 37.9 inch)

System Dimensions
Footprint	W: 1060 mm (3.5 ft) x D: 1352 mm (4.4 ft) x H: 2028 mm (6.7 ft)
Weight	~750 kgs

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